JPH0361358B2 - - Google Patents

Info

Publication number
JPH0361358B2
JPH0361358B2 JP16401582A JP16401582A JPH0361358B2 JP H0361358 B2 JPH0361358 B2 JP H0361358B2 JP 16401582 A JP16401582 A JP 16401582A JP 16401582 A JP16401582 A JP 16401582A JP H0361358 B2 JPH0361358 B2 JP H0361358B2
Authority
JP
Japan
Prior art keywords
layer
conductor
plating
green sheet
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16401582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5954297A (ja
Inventor
Yoshitaka Fukuoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP16401582A priority Critical patent/JPS5954297A/ja
Publication of JPS5954297A publication Critical patent/JPS5954297A/ja
Publication of JPH0361358B2 publication Critical patent/JPH0361358B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
JP16401582A 1982-09-22 1982-09-22 グリ−ンシ−ト印刷配線基板の製造方法 Granted JPS5954297A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16401582A JPS5954297A (ja) 1982-09-22 1982-09-22 グリ−ンシ−ト印刷配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16401582A JPS5954297A (ja) 1982-09-22 1982-09-22 グリ−ンシ−ト印刷配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS5954297A JPS5954297A (ja) 1984-03-29
JPH0361358B2 true JPH0361358B2 (en]) 1991-09-19

Family

ID=15785155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16401582A Granted JPS5954297A (ja) 1982-09-22 1982-09-22 グリ−ンシ−ト印刷配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS5954297A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6115394A (ja) * 1984-07-02 1986-01-23 東京プリント工業株式会社 ジヤンパ−層等を備えた複合プリント配線基板の積層方法
JPS61147597A (ja) * 1984-12-21 1986-07-05 株式会社住友金属セラミックス セラミック回路基板の製造方法

Also Published As

Publication number Publication date
JPS5954297A (ja) 1984-03-29

Similar Documents

Publication Publication Date Title
JP3765627B2 (ja) 多層回路基板及びその製造方法
US4420364A (en) High-insulation multi-layer device formed on a metal substrate
JPH0936549A (ja) ベアチップ実装用プリント基板
JP3988227B2 (ja) 半導体チップ搭載用基板の製造法および半導体装置
KR100658022B1 (ko) 회로 장치의 제조 방법
JPH0529537A (ja) 半導体モジユール構造
US6225028B1 (en) Method of making an enhanced organic chip carrier package
JPH0361358B2 (en])
JPH0210571B2 (en])
JPS6359535B2 (en])
JP2001160681A (ja) 多層セラミック基板およびその製造方法
JPH06310861A (ja) セラミック多層基板におけるサーマルビアの形成方法
JP4570225B2 (ja) 金属箔付フィルム及びそれを用いた多層配線基板の製造方法
JPS5850437B2 (ja) 多層配線基板の製造方法
JP3250166B2 (ja) 積層複合電子部品
JPH05226385A (ja) 半導体装置の実装方法
JPH0278253A (ja) 多層プラスチックチップキャリア
CN118366933A (zh) 电子封装件及其封装基板与制法
JPS6346592B2 (en])
JPS6317589A (ja) 二層プリント回路基板
JPS6317547A (ja) 半導体装置
JPS61287253A (ja) 半導体装置
JPS58114497A (ja) セラミツク多層回路基板およびその製造方法
JPH0282691A (ja) 半導体素子の実装構造
JPS6364918B2 (en])